How to achieve higher yields in semiconductor backend applications

Are you interested in discovering how Openair-Plasma^®  improves wetting and adhesion across the semiconductor backend process chain? And how to monitor this technology for maximum effectiveness?

Join this free PlasmaTalk in cooperation with our partner KRÜSS! Our Experts Dr. Andrew Mellor (KRÜSS)  and Nico Coenen (Plasmatreat) and will combine their expertise in surface analysis and plasma treatment.

What you'll learn:

• An in-depth overview of Openair-Plasma^® technology and its benefits
• How plasma surface treatment optimizes surface properties, increasing yield and adhesion in semiconductor processes
• Methods for analyzing wetting and adhesion in key backend steps
• Real-world applications, including quality control with micro contact angle measurement and optimizing the wetting of potting compounds

Key Takeaways:

• Improve yield and long-term stability in semiconductor processes
• Evaluate cleanliness prior to wire bonding using micro contact angle measurements
• Improve potting flow for glob top and dam encapsulation
• Practical insights from case studies and real-world examples

Whether your focus is on improving adhesion, cleaning, or coating in semiconductor manufacturing, this webinar will provide practical strategies to enhance the efficiency and performance of your production line.

Don't miss out! Reserve your seat today and start optimizing your semiconductor processes with the power of Openair-Plasma^® technology. 

The PlasmaTalk will last approximately 40-60 minutes and will include a question and answer session. If you have a specific question, please send it in advance to academy@plasmatreat.com so that we can include it in the program. Please note that due to our international audience, we will be using UTC (Coordinated Universal Time). Please check your time zone using the TimeCalc calculator below.