Can I substitute the vacuum plasma and its limitations by Openair-Plasma® for semiconductor applications? Yes, of course! Openair-Plasma® atmospheric plasma technology facilitates the selective treatment of electronic components and can be fully integrated into standard in-line processes.

Why should I consider using an Openair-Plasma® process, if my current process is working fine?

 
Openair-Plasma® has many advantages being:

• Speed and inline processing
• Great uniformity regardless of product change
• Cost benefits (investment and running costs)

This PlasmaTalk will be presented by Nico Coenen, our global BDM for the electronics market.
Topics Covered:

• Differences vacuum and Openair-Plasma®
  • Which gases are typically used?
  • What cycle times are we talking about
  • Case study on cost of ownership
• Successful applications:
  • Wire Bonding
  • Die Bonding
  • Pre-Molding
  • Thermal Compress Bonding
  • Reduction of Lead frames

The webinar will run for 40 min plus a Q&A session. If you have a specific request, please email us to academy@plasmatreat.com in advance of the webinar so we can include it into the program.